PENANG: Global Electronics Association and MIMOS Bhd have signed a memorandum of understanding (MoU) to strengthen Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP).

The collaboration aims to support industry alignment, capability development and the adoption of global standards and best practices, as Malaysia positions itself as a key hub in the regional and global semiconductor value chain.

In a statement, Global Electronics Association said the MoU outlines cooperation across several areas, including advisory on global market trends, development of standards and best practices, capability building through workshops, technical validation support, and broader ecosystem engagement with industry, academia and government stakeholders.

MIMOS Technologies Sdn Bhd chief executive officer Afdzal Syahadat Husin said the collaboration comes at a critical phase for Malaysia’s electronics sector, driven by increasing complexity in next-generation technologies and the shift towards advanced packaging.

“This collaboration reflects a shared commitment to strengthening Malaysia’s position within the global value chain by fostering deeper industry alignment, accelerating capability development, and advancing the adoption of globally recognised standards and best practices.